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c3110kfr.pdf - 109.4 KBytes. graphicdriverinstallation_ep-m845b.pdf - 230.7 KBytes. IPC_Security_Guideline_DE.pdf - 3284.5 KBytes. Supercedes IPC-L-108, IPC-L-109, IPC-L-112, IPC-L-115 IPC-AM-361. A standard developed by the Institute for Interconnecting and Packaging (IPC-MF-150, grade 3) J - Copper, electrodeposited, annealed (IPC-MF-150, grade 4) K - Copper, wrought, light cold rolled (IPC-MF-150, grade 6) L Global Engineering Documents 1990 M Street N.W. Washington, DC IPC-782-9-5-1 Figure 1 CFP construction Page 1 of 4 Subject CFP IPC-SM-782 Date 8/93 Section 9.5 Revision 4.0 COMPONENT DIMENSIONS Figure 2 provides the component dimensions for CFP components. ▼ T W ▼ ▼ ▼ B

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